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Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
Positive Supply Voltage (V
DD
) to GND
0.3, +3.6
V
D+
0.3 to V
DD
 + 0.3
V
D to GND
0.3 to +0.6
V
SCLK, SDATA, ALERT
, THERM
0.3 to +3.6
V
Input Current, SDATA, THERM
1, +50
mA
Input Current, D
?
mA
ESD Rating, All Pins (Human Body Model)
1,500
V
Maximum Junction Temperature (T
J
 
MAX
)
150
癈
Storage Temperature Range
65 to +150
癈
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE:   This device is ESD sensitive. Use standard ESD precautions when handling.
Table 3. THERMAL CHARACTERISTICS (Note 1)
Package Type
q
JA
q
JC
Unit
10-lead WDFN
142
43.74
癈/W
1.  q
JA
 is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.
Table 4. SMBus/I
2
C TIMING SPECIFICATIONS (Note 1)
Parameter
Limit at T
MIN
 and T
MAX
Unit
Description
f
SCLK
400
kHz max

t
LOW
1.3
ms min
Clock Low Period, between 10% Points
t
HIGH
0.6
ms min
Clock High Period, between 90% Points
t
R
300
ns max
Clock/Data Rise Time
t
F
300
ns max
Clock/Data Fall Time
t
SU;
 
STA
600
ns min
Start Condition Setup Time
t
HD;
 
STA
 (Note 2)
600
ns min
Start Condition Hold Time
t
SU;
 
DAT
 (Note 3)
100
ns min
Data Setup Time
t
SU;
 
STO
 (Note 4)
600
ns min
Stop Condition Setup Time
t
BUF
1.3
ms min
Bus Free Time between Stop and Start Conditions
1.  Guaranteed by design, but not production tested.
2.  Time from 10% of SDATA to 90% of SCLK.
3.  Time for 10% or 90% of SDATA to 10% of SCLK.
4.  Time for 90% of SCLK to 10% of SDATA.
Figure 2. Serial Bus Timing
STOP
START
t
SU; DAT
t
HIGH
t
F
t
HD; DAT
t
R
t
LOW
t
SU; STO
STOP  START
SCLK
SDATA
t
BUF
t
HD; STA
t
HD; STA
t
SU; STA
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